Control the deposition uniformity using ring cathode by DC discharge technique
Main Article Content
Abstract
Simulation of direct current (DC) discharge plasma using
COMSOL Multiphysics software were used to study the uniformity
of deposition on anode from DC discharge sputtering using ring and
disc cathodes, then applied it experimentally to make comparison
between film thickness distribution with simulation results. Both
simulation and experimental results shows that the deposition using
copper ring cathode is more uniformity than disc cathode
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How to Cite
1.
Aadim KA. Control the deposition uniformity using ring cathode by DC discharge technique. IJP [Internet]. 2019 Jan. 11 [cited 2024 Nov. 24];15(32):57-6. Available from: https://ijp.uobaghdad.edu.iq/index.php/physics/article/view/156
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© 2023 The Author(s). Published by College of Science, University of Baghdad. This is an open-access article distributed under the terms of the Creative Commons Attribution 4.0 International License.