Control the deposition uniformity using ring cathode by DC discharge technique

Article Sidebar

[email protected]
Published: Jan 11, 2019
DOI: https://doi.org/10.30723/ijp.v15i32.156
Keywords:
Simulation, DC discharge, sputtering.

Main Article Content

Kadhim A. Aadim

Abstract

Simulation of direct current (DC) discharge plasma using
COMSOL Multiphysics software were used to study the uniformity
of deposition on anode from DC discharge sputtering using ring and
disc cathodes, then applied it experimentally to make comparison
between film thickness distribution with simulation results. Both
simulation and experimental results shows that the deposition using
copper ring cathode is more uniformity than disc cathode

Article Details

How to Cite
1.
Aadim KA. Control the deposition uniformity using ring cathode by DC discharge technique. IJP [Internet]. 2019 Jan. 11 [cited 2024 Dec. 19];15(32):57-6. Available from: https://ijp.uobaghdad.edu.iq/index.php/physics/article/view/156
Issue
Vol. 15 No. 32 (2017)
Section
Articles
Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.

© 2023 The Author(s). Published by College of Science, University of Baghdad. This is an open-access article distributed under the terms of the Creative Commons Attribution 4.0 International License. 

Similar Articles

You may also start an advanced similarity search for this article.

Most read articles by the same author(s)

1 2 > >>