Enhancement of thermal stability and wettability for epoxy/Cu coated carbon fiber composites

epoxy/Cu coated carbon fiber composites

  • Reem Y. Mahmood University of Baghdad/College of Science/ Department of Physics
  • aseel alobaedy University of Baghdad/College of Science/ Department of Physics
Keywords: reducing agent; carbon fiber modification; copper plating; complexing agent.

Abstract

    This research study the effect of surface modification and copper (Cu) plating carbon fiber (CF) surface on the thermal stability and wettability of carbon fiber (CF)/epoxy (EP) composites. The TGA result indicates that the thermal-stability of carbon fiber may be enhanced after Cu coating CF. TGA curve showed that the treatment temperature was enhanced thermal stability of Ep/CF, this is due to the oxidation during heating. The Cu plating increased the thermal conductivity, this increase might be due to reduce in contact resistance at the interface due to chemical modification and copper plating and tunneling resistance.

   The increase of surface polarity after coating cause decrease in  the value of contact angle. As well as the increase of CuO as a function of the heat temperature cause the rapid contact angle decrease and can strongly enhance the wettability.

 

Published
2020-11-30
How to Cite
1.
Mahmood R, alobaedy aseel. Enhancement of thermal stability and wettability for epoxy/Cu coated carbon fiber composites. IJP [Internet]. 30Nov.2020 [cited 19Sep.2021];18(47):55-1. Available from: https://ijp.uobaghdad.edu.iq/index.php/physics/article/view/611
Section
Articles