Effect of Organic / Inorganic Gate Materials on the Organic Field-Effect Transistors Performance

Main Article Content

Zainab N.Hashim
https://orcid.org/0009-0003-4640-0384
Estabraq T. Abdullah
https://orcid.org/0000-0002-2893-3529

Abstract

The choice of gate dielectric materials is fundamental for organic field effect transistors (OFET), integrated circuits, and several electronic applications. The operation of the OFET depends on two essential parameters: the insulation between the semiconductor layer and the gate electrode and the capacitance of the insulator. In this work, the electrical behavior of a pentacene-based OFET with a top contact / bottom gate was studied. Organic polyvinyl alcohol (PVA) and inorganic hafnium oxide (HfO2) were chosen as gate dielectric materials to lower the operation voltage to achieve the next generation of electronic applications. In this study, the performance of the OFET was studied using monolayer and bilayer gate insulators. To model and analyze a device's electrical properties, MATLAB was used. Two main parameters were studied: switching ratio (Ion/Ioff) and subthreshold swing (SS), as well as the effect of dielectric capacitance on the gate dielectric materials. The PVA/HfO2 bilayer gate dielectric gave the best results in Ion/Ioff ratio, SS and transconductance of 9.05´10-7, -1.52, and -4.99 x10-5A/V respectively, which is because the dielectric capacitance has increased.

Article Details

How to Cite
1.
N.Hashim Z, T. Abdullah E. Effect of Organic / Inorganic Gate Materials on the Organic Field-Effect Transistors Performance. IJP [Internet]. 2023 Jun. 1 [cited 2024 Nov. 19];21(2):84-90. Available from: https://ijp.uobaghdad.edu.iq/index.php/physics/article/view/1113
Section
Articles
Author Biographies

Zainab N.Hashim, Department of Physics/ College of Science / University of Baghdad/ Baghdad/Iraq

 

 

 

Estabraq T. Abdullah, Department of Physics/ College of Science / University of Baghdad/ Baghdad/Iraq

 

 

 

References

W. S. Alghamdi, A. Fakieh, H. Faber, Y.-H. Lin, W.-Z. Lin, P.-Y. Lu, C.-H. Liu, K. N. Salama, and T. D. Anthopoulos, Appl. Phys. Lett. 121, 233503 (2022).

M. Małachowski and J. Żmija, Opto-Elect. Rev. 18, 121 (2010).

B. H. Mohammed and E. T. Abdullah, Iraqi J. Sci. 61, 1040 (2020).

J. Li, W. Tang, Q. Wang, W. Sun, Q. Zhang, X. Guo, X. Wang, and F. Yan, Mater. Sci. Eng.: R: Rep. 127, 1 (2018).

R. Raveendran and M. A. Namboothiry, AIP Conf. Proce. (AIP Publishing LLC, 2019). p. 070005.

S. Bathla and N. Gaur, 4th Intern. Conf. Elect., Commun. Aeros Tech (ICECA) (IEEE, 2020). p. 182.

U. Farok, Y. Falinie, A. Alias, B. Gosh, I. Saad, A. Mukifza, and K. Anuar, 1st Inter. Conf. Artif. Intel., Model. Simul. (IEEE, 2013). p. 459.

B. Nketia‐Yawson and Y. Y. Noh, Advan. Func. Mater. 28, 1802201 (2018).

A. J. Kadhima, E. T. Abdullahb, and A. K. Judranc, Eng. Tech. J. 39, 1688 (2021).

G. S. R. Mullapudi, G. A. Velazquez-Nevarez, C. Avila-Avendano, J. A. Torres-Ochoa, M. A. Quevedo-LóPez, and R. Ramírez-Bon, ACS Appl. Elect. Mater. 1, 1003 (2019).

L. Ismail, S. Samsul, M. Musa, and S. Norsabrina, IOP Conf. Ser.: Mat. Sci. Eng. (IOP Publ., 2018). p. 012005.

N. Afsharimani and B. Nysten, Bullet. Mat. Sci. 42, 26 (2019).

A. Nawaz and I. A. Hümmelgen, J. Mat. Sci.: Mat. Elect. 30, 5299 (2019).

Y. Wang, X. Huang, T. Li, L. Li, X. Guo, and P. Jiang, Chem. Mat. 31, 2212 (2019).

A. Singh and M. K. Singh, 2020 Inter. Conf. Advan. Comp. Commun. Mat. (ICACCM) (IEEE, 2020). p. 301.

J. Veres, S. Ogier, G. Lloyd, and D. De Leeuw, Chem. Mat. 16, 4543 (2004).

B. Kumar, B. Kaushik, Y. S. Negi, P. Mittal, and A. Mandal, IEEE Rece. Advan. Intell. Comput. Syst. (IEEE, 2011). p. 706.

Y. Liu, Y. Wang, X. Li, and Z. Hu, Mat. Res. Expr. 9, 076301 (2022).

S. Jung, Y. Bonnassieux, G. Horowitz, S. Jung, B. Iñiguez, and C.-H. Kim, IEEE J. Elect. Dev. Soci. 8, 1404 (2020).

S. Ruzgar and M. Caglar, Synth. Met. 232, 46 (2017).

M. Kitamura and Y. Arakawa, J. Phys.: Condens. Matter. 20, 184011 (2008).

O. A. Ibrahim and E. T. Abdullah, Basrah J. Sci. 39, (2021).

Similar Articles

You may also start an advanced similarity search for this article.