Control the deposition uniformity using ring cathode by DC discharge technique

Main Article Content

Kadhim A. Aadim

Abstract

Simulation of direct current (DC) discharge plasma using
COMSOL Multiphysics software were used to study the uniformity
of deposition on anode from DC discharge sputtering using ring and
disc cathodes, then applied it experimentally to make comparison
between film thickness distribution with simulation results. Both
simulation and experimental results shows that the deposition using
copper ring cathode is more uniformity than disc cathode

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1.
Control the deposition uniformity using ring cathode by DC discharge technique. IJP [Internet]. 2019 Jan. 11 [cited 2024 Mar. 28];15(32):57-6. Available from: https://ijp.uobaghdad.edu.iq/index.php/physics/article/view/156
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How to Cite

1.
Control the deposition uniformity using ring cathode by DC discharge technique. IJP [Internet]. 2019 Jan. 11 [cited 2024 Mar. 28];15(32):57-6. Available from: https://ijp.uobaghdad.edu.iq/index.php/physics/article/view/156

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